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| Part Number: ZDG24X109S www.SunLED.com 3.5x2.8 mm SMD CHIP LED LAMP PRELIMINARY SPEC Features SINGLE COLOR. SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. AVAILABLE ON TAPE AND REEL. IDEAL FOR BACKLIGHTING. WHITE SMD PACKAGE, SILICONE RESIN. LOW THERMAL RESISTANCE. PACKAGE: 1500PCS / REEL. MOISTURE SENSITIVITY LEVEL : LEVEL 2a. RoHS COMPLIANT. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. Operating Characteristics (TA=25C) DG24 ( InGaAlN) IF Rth PT TA Tstg 150 170 570 -40 ~ +85 -40 ~ +85 Unit mA C /W mW C Forward Voltage (Typ.) (IF=150mA) Forward Voltage (Max.) (IF=150mA) Wavelength of Peak Emission (Typ.) (IF=150mA) Wavelength of Dominant Emission (Typ.) (IF=150mA) Spectral Line Full Width At Half-Maximum (Typ.) (IF=150mA) Capacitance (Typ.) (VF=0V, f=1MHz) VF VF DG24 ( InGaAlN) 3.4 3.8 Unit V V Absolute Maximum Ratings (TA=25C) Forward Current Thermal Resistance Power Dissipation Operating Temperature Storage Temperature P 515 nm D 525 nm 30 nm C 45 pF Part Number Emitting Color Emitting Material Lens-color Luminous Intensity (IF=150mA) mcd min. typ. 7490 Luminous Flux (IF=150mA) mlm min. 18000 typ. 21000 Wavelength nm P Viewing Angle 2 1/2 ZDG24X109S Green InGaAlN Water Clear 6700 515 120 Published Date : FEB 25, 2008 Drawing No : SDSA6169 V1 Checked : B.L.LIU P.1/5 Part Number: ZDG24X109S www.SunLED.com 3.5x2.8 mm SMD CHIP LED LAMP Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. Published Date : FEB 25, 2008 Drawing No : SDSA6169 V1 Checked : B.L.LIU P.2/5 Part Number: ZDG24X109S www.SunLED.com 3.5x2.8 mm SMD CHIP LED LAMP DG24 Published Date : FEB 25, 2008 Drawing No : SDSA6169 V1 Checked : B.L.LIU P.3/5 Part Number: ZDG24X109S www.SunLED.com 3.5x2.8 mm SMD CHIP LED LAMP Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) The device has a single mounting surface. The device must be mounted according to the specifications. Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, luminous intensity / luminous flux or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous Intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Published Date : FEB 25, 2008 Drawing No : SDSA6169 V1 Checked : B.L.LIU P.4/5 Part Number: ZDG24X109S www.SunLED.com 3.5x2.8 mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS ZDG24X109S Published Date : FEB 25, 2008 Drawing No : SDSA6169 V1 Checked : B.L.LIU P.5/5 |
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